10th July 2023
Two of our submissions are accepted for oral presentations at IEEE FLEPS 2023 (IEEE International Conference on Flexible, Printable Sensors and Systems), which will be held in Boston, Massachusetts, USA. Congratulations!
- Duhee Kim, Boil Kim, Nari Hong, Han Kyoung Choe, Hongki Kang*, “Optimization of Inkjet-Printed Seed Layer Based Flexible, Transparent Metal Electrode for Bio-Signal Sensing”
- Soohyun Park†, Min Hye Shin†, Hongki Kang* and Yoonhee Lee*, “Massive fabrication of carbon nanotube transistors by surface tension-driven inkjet-printing method”